Removes resinous flux, soldering paste, ionic and non-ionic residues, drilling, grinding, polishing and lapping residues, fingerprints, fat, oil etc.

From non-ferrous and light metals, steel, stainless steel, glass, ceramics, plastics, rubber, assembled and non-assembled printed circuit boards, soldering frames, electronic components, boards etc.

• Concentrated
• Gentle to material
• Demulsifying
• Tenside free, non-foaming
• Phosphate free

Main active agents: alkali, inhibitors

Alkaline, pH 10.7 at 1%

Application in the ultrasonic bath 10% concentration for 30 to 180 seconds